Analog Devices
ADUCM331WFSBCPZ-RL
MCU 32-bit ARM Cortex M3 RISC 128KB Flash Automotive 32-Pin LFCSP EP T/R
Технические характеристики Analog Devices ADUCM331WFSBCPZ-RL, атрибуты и параметры.
Lead-Free Status:
Contains Lead
Статус жизненного цикла:
Contact
Количество выводов:
32
RoHS:
Compliant
- MCU 32-bit ARM Cortex M3 RISC 128KB Flash Automotive 32-Pin LFCSP EP T/R
- IC MCU 32BIT 128KB FLASH 32LFCSP
- The ADuCM330WFS/ADuCM331WFS are fully integrated, 8 kHz data acquisition systems that incorporate dual, high performance multichannel Σ-Δ analog-to-digital converters (ADCs), a 32-bit Arm® Cortex™-M3 processor, and flash. The ADuCM330WFS has 96 kB Flash/EE, and the ADuCM331WFS has 128 kB Flash/EE memory. Both have 4 kB data flash. Error correction code (ECC) is available on all flash and SRAM memories. The ADuCM330WFS/ADuCM331WFS are complete system solutions for battery monitoring in 12 V automotive applications. The ADuCM330WFS/ADuCM331WFS integrate all of the required features to precisely and intelligently monitor, process, and diagnose 12 V battery parameters including battery current, voltage, and temperature over a wide range of operating conditions. Minimizing external system components, the device is powered directly from a 12 V battery. On-chip, low dropout (LDO) regulators generate the supply voltage for two integrated Σ-Δ ADCs. The ADCs precisely measure battery current, voltage, and temperature to characterize the state of the health and the charge of the car battery. The device operates from an on-chip, 16.384 MHz high frequency oscillator that supplies the system clock that is routed through a programmable clock divider, from which the core clock operating frequency is generated. The device also contains a 32 kHz oscillator for low power operation. The analog subsystem consists of an ADC with a programmable gain amplifier (PGA) that allows the monitoring of various current and voltage ranges. The analog subsystem also includes a precision reference on chip. The ADuCM330WFS/ADuCM331WFS integrate a range of on-chip peripherals that can be configured under core software control as required in the application. These peripherals include a serial port interface (SPI) serial input/output communication controller, six general-purpose input/output (GPIO) pins, one general-purpose timer, a wake-up timer, and a watchdog timer. See the ADuCM330WFS/ADuCM331WFS Hardware Reference Manual for more information. The ADuCM330WFS/ADuCM331WFS are designed to operate in battery-powered applications where low power operation is critical. The microcontroller core can be configured in normal operating mode, resulting in an overall system current consumption of 18.5 mA when all peripherals are active. The device can also be configured in a number of low power operating modes under direct program control, consuming <100 μA. The ADuCM330WFS/ADuCM331WFS also include a local interconnect network (LIN) physical interface for single-wire, high voltage communications in automotive environments. The LIN transceiver is compliant to LIN 2.2 and Society of Automotive Engineers (SAE) J2602-2. The device operates from an external 3.6 V to 19 V (on VDD, Pin 26) voltage supply and is specified over the −40°C to +115°C temperature range, with additional typical specifications at +115°C to +125°C. The information in this data sheet is relevant for Silicon Revision P60. The ADuCM330WFS/ADuCM331WFS are developed for use in ISO 26262 applications for Automotive Safety Integrity Level Capability A (ASIL A). The ADuCM330WFS/ADuCM331WFS are low electromagnetic emissions and high electromagnetic immunity devices. Multifunction pin names may be referenced by their relevant function only. Applications Battery sensing and management for automotive and light mobility vehicles Lead acid battery measurement for power supplies in industrial and medical domains
Документы по Analog Devices ADUCM331WFSBCPZ-RL, инструкции, описания, datasheet.
Товары похожие на Analog Devices ADUCM331WFSBCPZ-RL, сравнение характеристик.
Тип корпуса / Кейс UQFN.
FLASH Memory Size 16000 B.
Lead-Free Status Contains Lead.
Статус жизненного цикла Not Listed by Manufacturer.
Mounting Style Surface Mount.
Рабочая Температура -40.0 °C (min).
Упаковка Tube.
Количество выводов 28.
RoHS Compliant.
Supply Voltage (DC) 3.00 V (min).
Время доступа 4.00 µs.
Тип корпуса / Кейс SOT-23.
Clock Speed 4.00 MHz (max), 4.00 MHz.
Основная архитектура PIC.
Lead-Free Status Contains Lead.
Статус жизненного цикла Active.
Mounting Style Surface Mount.
Number of I/O Pins 4.
Рабочая Температура 125 °C (max).
Упаковка Tape, Tape & Reel (TR).
Количество выводов 6.
RAM Memory Size 16 B.
RoHS Compliant.
Supply Voltage (DC) 5.50 V (max), 2.00 V (min).
Время доступа 33.0 µs.
Тип корпуса / Кейс BGA.
Clock Speed 33.0 MHz (max), 33.0 MHz.
Основная архитектура ARM.
Core Sub-Architecture ARM7.
Lead-Free Status Contains Lead.
Статус жизненного цикла Not Listed by Manufacturer.
Mounting Style Surface Mount.
Количество бит 32.
Number of I/O Pins 58.
Рабочая Температура 85.0 °C (max).
Упаковка Tray.
Количество выводов 176.
RAM Memory Size 8192 B.
REACH SVHC Compliance No SVHC.
RoHS Compliant.
Supply Voltage (DC) 2.70 V (min).
Тип корпуса / Кейс SOIC.
Clock Speed 40.0 MHz (max), 20.0 MHz.
Основная архитектура dsPIC.
Lead-Free Status Contains Lead.
Статус жизненного цикла Active.
Mounting Style Surface Mount.
Number of I/O Pins 20.
Рабочая Температура 125 °C (max).
Упаковка Tube, Rail.
Количество выводов 28.
RAM Memory Size 2048 B.
RoHS Compliant.
Supply Voltage (DC) 5.50 V (max), 5.00 V.
Тип корпуса / Кейс TQFP.
Clock Speed 40.0 MHz (max), 20.0 MHz.
Основная архитектура dsPIC.
FLASH Memory Size 48000 B.
Lead-Free Status Contains Lead.
Статус жизненного цикла Active.
Mounting Style Surface Mount.
Количество бит 16.
Number of I/O Pins 30.
Рабочая Температура -40.0 °C to 125 °C.
Упаковка Tray.
Количество выводов 44.
RAM Memory Size 2048 B.
REACH SVHC Compliance No SVHC.
RoHS Compliant.
Supply Voltage (DC) 2.50 V (min), 5.50 V (max).
Время доступа 40.0 µs.
Тип корпуса / Кейс QFN.
Clock Speed 40.0 MHz (max), 40.0 MHz.
Основная архитектура PIC.
Core Sub-Architecture PIC18.
Lead-Free Status Contains Lead.
Статус жизненного цикла Active.
Mounting Style Surface Mount.
Number of I/O Pins 25.
Рабочая Температура 125 °C (max).
Упаковка Bulk.
Количество выводов 28.
RAM Memory Size 1536 B.
RoHS Compliant.
Supply Voltage (DC) 4.20 V (min), 5.50 V (max).
Тип корпуса / Кейс DIP.
Clock Speed 40.0 MHz (max), 20.0 MHz.
Основная архитектура dsPIC.
Lead-Free Status Contains Lead.
Статус жизненного цикла Active.
Mounting Style Through Hole.
Number of I/O Pins 30.
Рабочая Температура 125 °C (max).
Упаковка Tube, Rail.
Количество выводов 40.
RAM Memory Size 2048 B.
RoHS Compliant.
Supply Voltage (DC) 5.50 V (max), 5.00 V.
Тип корпуса / Кейс SOIC.
Lead-Free Status Contains Lead.
Статус жизненного цикла Active.
Упаковка Tape & Reel (TR).
RoHS Compliant.
Время доступа 40.0 µs.
Тип корпуса / Кейс TQFP.
Clock Speed 40.0 MHz (max), 40.0 MHz.
Основная архитектура PIC.
Lead-Free Status Contains Lead.
Статус жизненного цикла Active.
Mounting Style Surface Mount.
Number of I/O Pins 36.
Рабочая Температура 85.0 °C (max).
Упаковка Tape, Tape & Reel (TR).
Количество выводов 44.
RAM Memory Size 2048 B.
RoHS Compliant.
Supply Voltage (DC) 5.50 V (max), 5.00 V.
Время доступа 40.0 µs.
Тип корпуса / Кейс QFN.
Clock Speed 40.0 MHz (max), 40.0 MHz.
Основная архитектура PIC.
Core Sub-Architecture PIC18.
Lead-Free Status Contains Lead.
Статус жизненного цикла Active.
Mounting Style Surface Mount.
Number of I/O Pins 25.
Рабочая Температура 85.0 °C (max).
Упаковка Tape, Tape & Reel (TR).
Количество выводов 28.
RAM Memory Size 768 B.
RoHS Compliant.
Supply Voltage (DC) 5.50 V (max), 5.00 V.
Тип корпуса / Кейс LQFP.
Lead-Free Status Contains Lead.
Статус жизненного цикла Not Listed by Manufacturer.
Mounting Style Surface Mount.
Упаковка Reel.
RoHS Compliant.